King-Ning TU

City University of Hong Kong, Hong Kong

Title: Reliability challenges in mobile technology for big data era

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Biography

K. N. Tu received his PhD on applied physics from Harvard University in 1968.  He spent 25 years in IBM T. J. Watson Research Center as Research Staff Member as well as Senior Manager of Materials Science Dept. in Physical Science Dept. before he joined UCLA as a full professor in 1993.  He retired in 2016 from UCLA as a Distinguished Emeritus Professor.  Then, he went to Taiwan and became TSMC Chair Professor as well as an E-Sun Scholar in National Yang-Ming Chiao Tung University in Hsinchu for 4 years.  Now, he is a Chair Professor in Dept. of Materials Science and Engineering as well as Dept. of Electrical Engineering in City University of Hong Kong.  He is a member of Academia Sinica, Taiwan.  His research interest has been about metal-silicon reactions, solder joint reactions, atomic layer reactions in nanowires, electromigration on interfacial reactions, microbump reactions in 3D IC, and kinetic theory in nanoscale materials.

Abstract

In the era of big data and internet of things, the use of consumer electronic products in all aspects of our daily life is manifested by the ubiquitous presence of mobile devices.  The continuing demand for smaller size, more functionality, lower power consumption, and reduced cost is challenging.  A paradigm change, from 2-dimensional integrated circuits (2D IC) to 3D IC, is occurring in microelectronics industry.  The vertical interconnect in 3-dimension by using through-Si-via and micro-bump is a new electronic packaging technique.  Statistical distribution of failure data as presented by mean-time-to-failure (MTTF) equation is required.  In this talk, MTTF equations for electromigration, thermomigration, and stress-migration will be presented on the basis of entropy production.